Samsung Electronics is reportedly set to invest over $7 billion in a new advanced chip packaging plant at its Taylor, Texas, site.
Samsung Electronics is reportedly planning to inject more than $7 billion into establishing a new advanced chip packaging facility in the U.S., concentrated at its Taylor, Texas, site.
South Korean outlet The Korea Economic Daily sources the figure at around KRW 10 trillion (roughly $7.2 billion) for the packaging project – an element of Samsung’s broader chip-manufacturing expansion that was previously shelved due to customer shortages.
The renewed focus on chip packaging is driven in part by Samsung’s recent contract to supply Tesla with AI 6 chips – a project that requires both production and packaging to be completed within the U.S. to avoid anticipated tariffs.
Samsung’s investment consideration reflects an urgent need to strengthen the domestic chip supply chain.
This initiative comes amid wider efforts to bolster U.S. semiconductor independence.
Combined with previous commitments, such as over $40 billion pledged for Texas fab construction and expansion under the CHIPS and Science Act, the potential packaging investment would contribute significantly to America’s chipmaking ecosystem.
While Samsung has not publicly confirmed the new funding, the move positions the company to become one of the largest semiconductor players in the U.S., rivalling TSMC’s local ambitions.
It also underscores the role of policy and strategic industry deals in shaping semiconductor infrastructure growth.
If executed, the facility would not only support the Tesla AI chip contract but also serve as a critical link in Samsung’s broader U.S. operations – from fabrication and research to packaging – solidifying its footprint in the American semiconductor landscape.
Samsung to invest over 7 bn USD into US chip packaging
