MediaTek has introduced its Dimensity 9500 flagship chip, built on 3nm technology and promising major gains in performance, power efficiency, and AI capabilities for next-generation smartphones.
MediaTek has officially revealed the Dimensity 9500.
Built on TSMC’s 3nm process technology, the MediaTek Dimensity 9500 uses a third-generation “All Big Core” CPU architecture: one ultra core running at 4.21GHz, three premium cores, and four performance cores.
The processor pairs this with four-lane UFS 4.1 storage to help with throughput and responsiveness.
JC Hsu, corporate senior vice president at MediaTek and general manager of the Wireless Communications Business Unit said in a statement: “As AI becomes part of everyday life, consumers want devices that feel smarter, faster, and more personal without sacrificing battery life.
“The MediaTek Dimensity 9500 delivers exactly that: Breakthrough on-device AI, top-tier performance and efficiency, and a full suite of premium experiences that our partners can bring to users around the world.”
In benchmark terms, MediaTek claims the new chip delivers up to 32 per cent higher single-core performance and 17 per cent higher multi-core performance compared to the previous generation, while achieving about 55 per cent lower power consumption at peak performance – a key gain likely to extend battery life during high demand tasks.
Graphics and AI capabilities also get a boost, as Dimensity has said the 9500 integrates an Arm Mali-G1 Ultra GPU and a next-gen NPU that supports improved generative AI and large-model inference.
The company also said imaging is more capable too, with support for captures up to 200MP sensors, 8K video encode/decode, and enhanced ISP features.
MediaTek has confirmed flagship phones running the Dimensity 9500 are expected in Q4 2025.
MediaTek unveils new Dimensity 9500 chip promising ‘top-tier performance and efficiency’ for AI
